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Supports various grades!
The Somacote IR series is a thermosetting adhesive for surface mounting. We offer various grades, including high adhesion type, low temperature curing type, dispensing type, and printing type.
Responding to your needs with a rich lineup! Introducing adhesives that can be cured with ultraviolet light and heat!
"PHOTOBOND 350H" is an adhesive that can be cured by ultraviolet light and heat. The hardness is 60. The viscosity is 480 mPa·s and the volume is 70cc. Additionally, the elongation rate is 48% and the shrinkage rate is 6.7%, with a shelf life of 6 months. Please feel free to contact us when you need it. 【Basic Properties (Partial)】 ■ Appearance: Light yellow liquid ■ Components: Modified acrylate ■ Viscosity: 480 mPa·s ■ Specific gravity: 0.99 ■ Shelf life: 6 months *For more details, please refer to the PDF document or feel free to contact us.
Shortening the curing process! Achieving application to materials with low heat resistance and suppression of warping and deformation due to thermal stress. Epoxy-based thermosetting adhesives and sealants.
★Are you facing any of the following issues? 〇 Want to bond low heat-resistant parts at a low curing temperature 〇 Want to relieve stress caused by heat 〇 Want to achieve snap curing inline 'Plain Set' is a one-component epoxy resin adhesive developed based on the technology of latent curing agents that our company has accumulated over the years. It is utilized in various fields such as precision electronic components like camera modules, semiconductor mounting, communication components, and car electronics. We offer a lineup of products with unique features, including: "Flexible Type" "Gas Barrier Type" "UV and Heat Combined Type" "Conductive Type," among others, with their respective characteristics available in the catalog. 【Features】 ■ Suitable for assembling electronic components that include heat-sensitive materials due to its low-temperature curing capability of below 80°C ■ Can cure in just a few seconds at low temperatures of 120°C and 150°C ■ With a low thermal history, it alleviates stress caused by material contraction during cooling, suppressing warping and deformation *For more details, please refer to the PDF materials or feel free to contact us. Also, please visit our company website at the URL below.
It can be used in a dual cure process with UV (ultraviolet) for temporary fixing and heat for final curing.
UVA-6150 K1 is an adhesive that allows dual curing with UV and thermal curing. <Features> ■ Temporary curing with UV and strength development with heat ■ Areas not exposed to UV can be cured with heat ■ Quick curing for positioning with UV ■ Low-temperature curing is possible with a thermal process at 80°C
